DOHA, Qatar – June 22, 2026: QIA today announced its participation in the $380 million Series D funding round of Nearfield Instruments , a leader in advanced semiconductor 3D metrology and process control.
The Series D round was led by Fidelity Management & Research Company, alongside Temasek, Walden Catalyst Ventures, Innovation Industries, M&G Investments, Invest-NL, TNO Ventures and ING and values Nearfield Instruments at $1.6 billion. The oversubscribed round represents the largest ever deep-tech funding round in the Netherlands.
The funding will serve to accelerate Nearfield Instruments' innovation roadmap, establish worldwide Applications Centers of Excellence, expand production capacity, strengthen its global customer support organization, and deepen collaborative R&D with leading semiconductor manufacturers.
Nearfield Instruments provides the metrology and inspection solutions needed to control advanced semiconductor processes, improve yield and ensure manufacturability. As AI continues to grow, the company plays a central role in making the next generation of AI computing scalable, energy-efficient and reliable.
QIA’s investment aligns with its focus on identifying and supporting market-leading, technology-enabled businesses with strong growth potential across the full AI stack.
About Nearfield Instruments
Nearfield Instruments develops advanced 3D metrology and inspection solutions for the semiconductor industry, specializing in next-generation scanning probe microscopy systems that deliver in-line 3D nanometer-scale metrology. Designed for seamless integration into high-volume manufacturing environments, Nearfield's solutions combine robust automation, fast measurement cycles, and compatibility with fab standards to support the next generation of semiconductor innovation. Its proprietary QUADRA platform enables non-destructive, high-throughput atomic force microscopy (AFM) with full 3D imaging capabilities, including sidewall measurements of complex structures such as high-aspect-ratio trenches, GAA recess, vias, and multi-layered stacks critical to advanced logic, memory, and 3D IC packaging applications. Founded in 2016 as a spin-off from TNO and headquartered in Rotterdam, the Netherlands, the company operates in Taiwan, South Korea, Japan, Singapore, the United States, and Belgium, to do R&D with its customers and support customers worldwide. Nearfield Instruments employs approximately 450 people globally and works closely with the world's leading semiconductor manufacturers and research partners.
For more information, visit www.nearfieldinstruments.com