DOHA, Qatar and Cambridge, Massachusetts – June 18, 2026 – QIA today announced its participation in HyperLight’s $80 million Series C funding round, supporting the company’s next phase of growth as it expands the production and deployment of its optical-chip technology to meet the growing networking and connectivity demands of AI data centers.
HyperLight is a leading developer of thin-film lithium niobate (TFLN) photonic chips that enable next-generation high-speed, energy-efficient optical connectivity for AI infrastructure, data centers, telecommunications networks and computing applications. The financing will support the expansion of HyperLight’s manufacturing capacity, accelerate customer qualification, scale deployment of its TFLN Chiplet™ Platform and deepen partnerships across the semiconductor, networking and systems integration ecosystem.
The round was led by MediaTek Innovation Fund with participation from investors across the global AI infrastructure value chain, including strategic investors from leading silicon and networking companies. It follows HyperLight’s recently announced partnership with UMC and Wavetek to support high-volume foundry production.
QIA’s investment reflects its continued focus on supporting innovative technology companies developing critical infrastructure for the next generation of AI and advanced computing. As demand for AI compute continues to increase, technologies that enable higher bandwidth, lower power consumption and more efficient network performance are expected to play an increasingly important role.
About HyperLight
HyperLight delivers high-performance integrated photonics solutions based on thin-film lithium niobate technology. The company combines the electro-optic advantages of TFLN with scalable manufacturing, test, and integration to enable next-generation optical engines for AI data centers, telecom and metro networks, and emerging photonics markets.